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Cutting-Edge Solutions for 5G Networking

As the demand for higher data speeds, low latency, and increased network capacity continues to grow, Winbond's technologies play a pivotal role in shaping the future of communication. Whether it's providing reliable storage for massive data or enhancing the efficiency of network infrastructure, Winbond empowers the evolution of 5G connectivity, ensuring that networks are not only faster and more responsive but also scalable and robust. With our dedication to pushing the boundaries of what is possible, Winbond is driving the transformation of the digital landscape and ushering in a new era of connectivity.

 

LTE/5G Cell Sites - Transforming Connectivity and Shaping the Future of Digital Communication

LTE/5G cell sites serve as the foundation of contemporary connectivity, flawlessly integrating the capabilities of Long-Term Evolution (LTE) and 5G technologies. Their advanced cell sites play a crucial role in meeting the growing requirements for high-speed data, low latency, and enhanced network capacity. The ongoing evolution of LTE/5G remains at the forefront of technological advancement, propelling connectivity to unprecedented levels and nurturing a connected world.

    Advanced Driver Assistance Systems (ADAS) (IT test by lisa)

     

    W25Q Serial NOR Flash

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    LTE/5G Cell Sites - Transforming Connectivity and Shaping the Future of Digital Communication

     

    LTE/5G cell sites serve as the foundation of contemporary connectivity, flawlessly integrating the capabilities of Long-Term Evolution (LTE) and 5G technologies. Their advanced cell sites play a crucial role in meeting the growing requirements for high-speed data, low latency, and enhanced network capacity. The ongoing evolution of LTE/5G remains at the forefront of technological advancement, propelling connectivity to unprecedented levels and nurturing a connected world.

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    Unleashing Seamless Data Transfers for Enhanced Networking and Set-Top Box Experiences

     

    The High-Speed Ethernet Switch is a pivotal component for efficient data transfer, serving as the central hub that connects devices in a network. Designed to ensure rapid data exchange and seamless communication, it provides a robust and high-performance network infrastructure for both industrial and commercial applications. In consumer premises equipment (CPE) and set-top boxes, this switch plays a crucial role in optimizing connectivity and enhancing user experiences. With its integration, users can enjoy smooth streaming, rapid internet access, and seamless connectivity. As the demand for faster and more reliable networks continues to grow, the high-speed Ethernet switch emerges as a critical component that shapes the future of networking and enhances set-top box capabilities.

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Automotive Solutions

CUBE(3DCaaS™)

Part No. Density Voltage (V) Frequency (Mbps) Temp (°C) Status-Automotive Automotive Datasheet
W955K8MBYA5A 32Mb 1.8/1.8 400 -40~85 P Contact us
W955K8MBYA5K 32Mb 1.8/1.8 400 -40~105 P Contact us
W955K8MBYA5S 32Mb 1.8/1.8 400 -40~125 P Contact us
W955N8MBYA5A 32Mb 3.0/3.0 400 -40~85 N Contact us
W955N8MBYA5K 32Mb 3.0/3.0 400 -40~105 N Contact us
W955N8MBYA5S 32Mb 3.0/3.0 400 -40~125 N Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

PSRAM

Part No. Density Voltage (V) Frequency (Mbps) Temp (°C) Status-Automotive Automotive Datasheet
W955K8MBYA5A 32Mb 1.8/1.8 400 -40~85 P Contact us
W955K8MBYA5AG 32Mb 1.8/1.8 400 -40~85 P Contact us
W955K8MBYA5K 32Mb 1.8/1.8 400 -40~105 P Contact us
W955K8MBYA5KG 32Mb 1.8/1.8 400 -40~105 P Contact us
W955K8MBYA5S 32Mb 1.8/1.8 400 -40~125 P Contact us
W955K8MBYA5SG 32Mb 1.8/1.8 400 -40~125 P Contact us
W955N8MBYA5A 32Mb 3.0/3.0 400 -40~85 N Contact us
W955N8MBYA5AG 32Mb 3.0/3.0 400 -40~85 N Contact us
W955N8MBYA5K 32Mb 3.0/3.0 400 -40~105 N Contact us
W955N8MBYA5KG 32Mb 3.0/3.0 400 -40~105 N Contact us
W955N8MBYA5S 32Mb 3.0/3.0 400 -40~125 N Contact us
W955N8MBYA5SG 32Mb 3.0/3.0 400 -40~125 N Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

KGD

Part No. Density Voltage (V) Frequency (Mbps) Temp (°C) Status-Automotive Automotive Datasheet
W955K8MBYA5A 32Mb 1.8/1.8 400 -40~85 P Contact us
W955K8MBYA5K 32Mb 1.8/1.8 400 -40~105 P Contact us
W955K8MBYA5S 32Mb 1.8/1.8 400 -40~125 P Contact us
W955N8MBYA5A 32Mb 3.0/3.0 400 -40~85 N Contact us
W955N8MBYA5K 32Mb 3.0/3.0 400 -40~105 N Contact us
W955N8MBYA5S 32Mb 3.0/3.0 400 -40~125 N Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

Serial NOR Flash

Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) Temp (°C) Interface Type Status-Automotive Automotive Datasheet
W25H01JVSFAM 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVSFAMG 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVSFSM 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01JVSFSMG 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01JVTBAM 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVTBAMG 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVTBSM 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01JVTBSMG 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01JVZEAM 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVZEAMG 1Gb 2.7~3.6 133 80 -40~105 SPI/Dual/Quad P Contact us
W25H01JVZESM 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01JVZESMG 1Gb 2.7~3.6 133 80 -40~125 SPI/Dual/Quad P Contact us
W25H01NWSFAM 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWSFAMG 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWSFSM 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
W25H01NWSFSMG 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
W25H01NWTBAM 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWTBAMG 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWTBSM 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
W25H01NWTBSMG 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
W25H01NWZEAM 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWZEAMG 1Gb 1.7~1.95 133 84 -40~105 SPI/Dual/Quad P Contact us
W25H01NWZESM 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
W25H01NWZESMG 1Gb 1.7~1.95 133 84 -40~125 SPI/Dual/Quad P Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

Octal NOR Flash

Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) Temp (°C) Interface Type Status-Automotive Automotive Datasheet
W35T01NWTBAE 1Gb 1.65~2 166 200 -40~105 SPI/Octal UD Contact us
W35T01NWTBAEG 1Gb 1.65~2 166 200 -40~105 SPI/Octal UD Contact us
W35T01NWTBAF 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T01NWTBAFG 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T01NWTBSE 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T01NWTBSEG 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T01NWTBSF 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T01NWTBSFG 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T02NWTBAF 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T02NWTBAFG 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T02NWTBSF 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
W35T02NWTBSFG 1Gb 1.65~2 166 200 - SPI/Octal UD Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

QspiNAND Flash

Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) Temp (°C) Interface Type Status-Automotive Automotive Datasheet
W25N01GVSFAG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVSFAGG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVSFKG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01GVSFKGG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01GVTBAG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVTBAGG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVTBAT 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVTBATG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVTBKG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01GVTBKGG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01GVZEAG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVZEAGG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVZEAT 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVZEATG 1Gb 2.7~3.6 104 - -40~105 SPI/Dual/Quad P Contact us
W25N01GVZEKG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01GVZEKGG 1Gb 2.7~3.6 104 - -40~115 SPI/Dual/Quad P Contact us
W25N01JWTBAG 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
W25N01JWTBAGG 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
W25N01JWTBAT 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
W25N01JWTBATG 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
W25N01JWTBKG 1Gb 1.7~1.95 166 80 -40~115 SPI/Dual/Quad P Contact us
W25N01JWTBKGG 1Gb 1.7~1.95 166 80 -40~115 SPI/Dual/Quad P Contact us
W25N01JWTBKT 1Gb 1.7~1.95 166 80 -40~115 SPI/Dual/Quad P Contact us
W25N01JWTBKTG 1Gb 1.7~1.95 166 80 -40~115 SPI/Dual/Quad P Contact us
W25N01JWZEAG 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
W25N01JWZEAGG 1Gb 1.7~1.95 166 80 -40~105 SPI/Dual/Quad P Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

SLC NAND Flash

Part No. Density Voltage (V) Temp (°C) Interface Type Status-Automotive Automotive Datasheet
W29N01HVBANA 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVBANAG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVBANF 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVBANFG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVBKNF 1Gb 2.7~3.6 -40~115 ONFI P Contact us
W29N01HVBKNFG 1Gb 2.7~3.6 -40~115 ONFI P Contact us
W29N01HVDANA 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVDANAG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVDANF 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVDANFG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVSANA 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVSANAG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVSANF 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HVSANFG 1Gb 2.7~3.6 -40~105 ONFI P Contact us
W29N01HWBANA 1Gb 1.7~1.95 -40~105 ONFI - Contact us
W29N01HWBANAG 1Gb 1.7~1.95 -40~105 ONFI - Contact us
W29N01HZBANA 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZBANAG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZBANF 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZBANFG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZDANA 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZDANAG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZDANF 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZDANFG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZSANA 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZSANAG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZSANF 1Gb 1.7~1.95 -40~105 ONFI S Contact us
W29N01HZSANFG 1Gb 1.7~1.95 -40~105 ONFI S Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

SpiStack® Flash

Boot Memory Configuration Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) NAND
Page Size
(Byte)		 NAND Spare Area (Byte) Temp (°C) Status-Automotive Automotive Datasheet
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVSFAT 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVSFATG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVTBAG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVTBAGG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVZEAG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVZEAGG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVZEAT 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
1Gb serial NAND 1Gb NAND +1Gb NAND W25M02GVZEATG 2Gb 2.7~3.6 104 - 2048 64 -40~105 P Contact us
Boot Memory Configuration Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) NAND
Page Size
(Byte)		 NAND Spare Area (Byte) Temp (°C) Status-Automotive Automotive Datasheet
256Mb NOR 256Mb NOR +256Mb NOR W25M512JVFSQ 512Mb 2.7~3.6 104 - - - -40~125 P Contact us
256Mb NOR 256Mb NOR +256Mb NOR W25M512JVFSQG 512Mb 2.7~3.6 104 - - - -40~125 P Contact us
256Mb NOR 256Mb NOR +256Mb NOR W25M512JWEAQ 512Mb 2.7~3.6 104 - - - -40~105 P Contact us
256Mb NOR 256Mb NOR +256Mb NOR W25M512JWEAQG 512Mb 2.7~3.6 104 - - - -40~105 P Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

Authentication Flash

Part No. Density Voltage (V) STR Frequency (MHz) DTR Frequency (MHz) Temp (°C) Interface Type Status-Automotive Automotive Datasheet
W74M12JWSSSQ 128Mb 1.7~1.95 104 - -40~125 Authentication Flash SPI/Dual/Quad P Contact us
W74M12JWSSSQG 128Mb 1.7~1.95 104 - -40~125 Authentication Flash SPI/Dual/Quad P Contact us
W74M12JWZPSQ 128Mb 1.7~1.95 104 - -40~125 Authentication Flash SPI/Dual/Quad S Contact us
W74M12JWZPSQG 128Mb 1.7~1.95 104 - -40~125 Authentication Flash SPI/Dual/Quad S Contact us
Status：P= Mass Production, S= Samples, UD= Under Development, N= Not Recommended For New Design

Resources

WinTech 2023 Recap Video

Video

Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

Product Press
W25Q64NE, a 1.2V SpiFlash® NOR Flash IC in a 64Mb density which offers the large code storage capacity and active mode power savings needed by the latest generation of smart wearable and mobile devices. Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device, which operates over an extended 1.14V-1.6V supply-voltage range for compatibility with a single alkaline AA battery cell’s output-voltage profile. By extending the 1.2V NOR Flash family to include a 64Mb part, Winbond addresses the requirements of smart devices with a larger code footprint. The new W25Q64NE is available for sampling and offer small package size like USON8-3x4 and WLCSP in industry-standard packages and pin-outs.
W25X, Nor, Flash, automotive, Computer, Industiral, HighPerformance

Winbond SpiStack’s Over-the-Air Support Enables Automobile and IoT Manufacturers to Leverage Two Stacked Dies for Faster, More Accurate Updates

Product Press
SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) updates in automobiles and IoT devices. With its innovative design that stacks two flash dies in a single package, SpiStack is the ideal solution for guaranteeing fast, reliable and risk-free OTA updates which is becoming a critical feature in automotive, internet of Things (IoT) and industrial applications. “OTA enables designers to deliver firmware updates over the air to ensure security and reliability of devices, and also offers a way to deliver new features and functionalities.” said Jooweon (JW) Park, VP of Code Storage Flash Memory at Winbond. “However, in order for this technology to be widely adopted in the future, it needs to be 100 percent successful and done quickly so that it does not cause any disruption to the user. This is where SpiStack has a unique advantage with its two stacked dies in a single device.”
automotive, Flash, Winbond, OTA, Over-the-Air, SpiStack

Automotive Flash Product Brief

Product Brief
automotive, spiflash, automotivegrade, W25Q, KGD, AECQ100, SPI, Quad, W25X, ADAS, 8pin, 16pin, wafer, cluster, bluetooth, FPGA, telematic, infotainment
  • File Type：PDF
  • Updated：30/08/2021
  • Download

Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards

Product Press
TrustME® W77Q Secure Flash has been selected as the winner of 2021 Elecfans IoT Technology Innovation Awards. Established by Elecfans, a well-known leading electronics industry-focus media in China, the IoT Innovation Award has been recognized on their outstanding performance and positive influence to the electronics industry since 2016. The IoT Technology Innovation Award is the high-end professional award presenting to the organizations for their great contribution to the new technology in China and the World. The W77Q Secure Flash memory is a revolutionary, drop-in replacement for existing Flash devices, supporting secure storage, secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and deviceuthentication The W77Q ensures robust, end-to-end security in IoT devices by enabling:
automotive, W77Q, TrustME®, over-the-air, SoC, ISO26262, SESIP level 2, Execute-in-Place (XiP)

Winbond Product Longevity Program

Product Brief
Longevity, Longevity program
  • File Type：PDF
  • Updated：30/05/2019
  • Download

High Performance QspiNAND is ready for Automotive Applications

Video

Winbond Memory Solution for Your Automotive

Video

New High-Performance QspiNAND: A Better High Density Storage Option for Automotive Display

Video
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