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Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

Product Press
W25Q64NE, a 1.2V SpiFlash® NOR Flash IC in a 64Mb density which offers the large code storage capacity and active mode power savings needed by the latest generation of smart wearable and mobile devices. Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device, which operates over an extended 1.14V-1.6V supply-voltage range for compatibility with a single alkaline AA battery cell’s output-voltage profile. By extending the 1.2V NOR Flash family to include a 64Mb part, Winbond addresses the requirements of smart devices with a larger code footprint. The new W25Q64NE is available for sampling and offer small package size like USON8-3x4 and WLCSP in industry-standard packages and pin-outs.
W25X, Nor, Flash, automotive, Computer, Industiral, HighPerformance

Winbond SpiStack’s Over-the-Air Support Enables Automobile and IoT Manufacturers to Leverage Two Stacked Dies for Faster, More Accurate Updates

Product Press
SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) updates in automobiles and IoT devices. With its innovative design that stacks two flash dies in a single package, SpiStack is the ideal solution for guaranteeing fast, reliable and risk-free OTA updates which is becoming a critical feature in automotive, internet of Things (IoT) and industrial applications. “OTA enables designers to deliver firmware updates over the air to ensure security and reliability of devices, and also offers a way to deliver new features and functionalities.” said Jooweon (JW) Park, VP of Code Storage Flash Memory at Winbond. “However, in order for this technology to be widely adopted in the future, it needs to be 100 percent successful and done quickly so that it does not cause any disruption to the user. This is where SpiStack has a unique advantage with its two stacked dies in a single device.”
automotive, Flash, Winbond, OTA, Over-the-Air, SpiStack

Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards

Product Press
TrustME® W77Q Secure Flash has been selected as the winner of 2021 Elecfans IoT Technology Innovation Awards. Established by Elecfans, a well-known leading electronics industry-focus media in China, the IoT Innovation Award has been recognized on their outstanding performance and positive influence to the electronics industry since 2016. The IoT Technology Innovation Award is the high-end professional award presenting to the organizations for their great contribution to the new technology in China and the World. The W77Q Secure Flash memory is a revolutionary, drop-in replacement for existing Flash devices, supporting secure storage, secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and deviceuthentication The W77Q ensures robust, end-to-end security in IoT devices by enabling:
automotive, W77Q, TrustME®, over-the-air, SoC, ISO26262, SESIP level 2, Execute-in-Place (XiP)
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