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Known Good Die (KGD) Several customers utilize Winbond’s expertise in using flash products in Known Good Die (KGD) for SIP (System In Package) solutions. Flash dies are stacked with Controller dies and put in a single package or module to provide SIP solutions. KGD of other devices can also be stack...

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Known Good Die (KGD) Several customers utilize Winbond’s expertise in using flash products in Known Good Die (KGD) for SIP (System In Package) solutions. Flash dies are stacked with Controller dies and put in a single package or module to provide SIP solutions. KGD of other devices can also be stack...

http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/kgd/index.html?__locale=en

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Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

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Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature KGD form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/gowin-embeds-winbond-64mb-hyperram-for-ai-edge-computing.html?__locale=en