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Winbond Product Longevity Program
AutomotiveProduct Brief
/product/files/DA05-0001A1.pdf
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Code Storage Flash Memory - NAND Based MCP
NAND Based MCP
Winbond’s Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on PCBs (Printed Circuit Boards). One of the benefits of NAND flash is its non-...
http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/nand-based-mcp/index.html?__locale=en
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Solution for Automotive applications based on the Fourth Generation and its extension version of Low Power DRAM (LPDDR4/4x)
Technical Article
Semiconductor Applications in Intelligent and Autonomous Vehicals Japan announced that it will demonstrate its autonomous vehicle technology during the Tokyo Olympics as the specific demonstration of intelligent automobiles in recent years. Driven by The Fifth Generation Mobile Networks (5G) and Art...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/automotive-solution-on-low-power-dram.html?__locale=en
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Why embedded developers are considering serial NAND Flash for code storage in systems that implement artificial intelligence
Technical Article
The potential for innovation created by artificial intelligence (AI) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of AI is not itself new: IBM’s Deep Blue AI system beat chess world ch...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/why-embedded-developers-are-considering-serial-nand-in-ai.html?__locale=en
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Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas
Event
Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to 10, 2014 to learn more about our memory solutions for internet of Things (IoT). More information at www.freescale.co...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00001.html?__locale=en
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Test for new column ProductLine 03
Application Note
http://20.24.31.78:8080/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/00TEST-DA00-0003.html&level=4
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Test for new column ProductLine 01
Application Note
http://20.24.31.78:8080/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/00TEST-DA00-0001.html&level=4
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Test for new column ProductLine 04
Application Note
http://20.24.31.78:8080/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/00TEST-DA00-0004.html&level=4
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Winbond Introduces TrustME™ Secure Flash Memory aligned with Platform Security Architecture from Arm
News
SAN JOSE, Calif., January 1, 2000--Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today issued an update on Y2K corporate conditions. Due to the Y2K roll-over, Winbond has experienced an electrical power outage. Although the outage affected all of Winbond's facilitie...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/news00001.html?__locale=en
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Winbond Memory Solution for Your Automotive
Video
There will be more IoT devices connected to cars in the future. Traditional Auto-Electronics like GPS/Infotainment, Cluster Controller and Engine Control use NOR-Flash and NAND-Flash. Winbond will focus on new segments such as ADAS and ADAS system programming as well as software stacks for autonomou...
http://20.24.31.78:8080/hq/hq/support/online-learning/video-item/video00011.html?__locale=en
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Winbond SpiStack’s Over-the-Air Support Enables Automobile and IoT Manufacturers to Leverage Two Stacked Dies for Faster, More Accurate Updates
News
Two stacked dies in a single device ensures more successful OTA updates by enabling one die to perform program/erase operations while the other performs read operations simultaneously. Enables OTA Management for Multiple ECUs, providing a suitable solution for using big density and fast programing N...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_spistack_ota_automobile_iot_two_stacked_dies_faster_more_accurate.html?__locale=en
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TrustME
TrustME®
Winbond TrustME® Secure Flash products strengthens the robustness by securing code and data storage for trusted boot and firmware updates using external secure flash. In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security...
http://20.24.31.78:8080/hq/hq/product/trustme/index.html?__locale=en
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TrustME - W75F Secure Memory Element
Secure Memory Element
W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...
http://20.24.31.78:8080/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en
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Product selection
Other
http://20.24.31.78:8080/hq/hq/support/faq/technical/.content/faq/faq00001.html?__locale=en
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A better high-density storage option for sophisticated automotive display applications
Technical Article
Automotive displays, both in the instrument cluster and in the Centre Information Display (CID), or head unit, are becoming larger, more sophisticated and more numerous. Thanks to the popularity of devices such as tablets and smartphones, car users have grown accustomed to interacting with technolog...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/a-better-high-density-storage-for-automotive-display.html?__locale=en
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Keyword search results for “ Longevity program ”, 118 Matches