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Winbond SpiStack’s Over-the-Air Support Enables Automobile and IoT Manufacturers to Leverage Two Stacked Dies for Faster, More Accurate Updates
News
Two stacked dies in a single device ensures more successful OTA updates by enabling one die to perform program/erase operations while the other performs read operations simultaneously. Enables OTA Management for Multiple ECUs, providing a suitable solution for using big density and fast programing N...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_spistack_ota_automobile_iot_two_stacked_dies_faster_more_accurate.html?__locale=en
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Live over-the-air system firmware updates to Flash
Technical Article
The long service life of products in the industrial and automotive sectors and the increasing availability of connectivity in these products compel IoT device manufacturers to address reliability and security problems or to implement feature enhancements via a process generally known as the Over-The...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/live-over-the-air-system-firmware-updates-to-flash.html?__locale=en
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Complete new cloud-to-device solution gives proven way to implement secure over-the-air firmware updates in IoT devices
News
Winbond, Nuvoton and Qinglianyun combine to connect secure microcontroller platform to Secure Device Management system in the cloud TAICHUNG, Taiwan – March 24, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, microcontroller manufacturer Nuvoton a...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/complete-new-cloud-to-device-solution-to-secure-over-the-air-firmware-updates-in-iot-devices.html?__locale=en
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Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)
Webinar
In today's webinar, we are going to talk about... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication. Register no...
http://20.24.31.78:8080/hq/hq/support/online-learning/webinars-item/webinars00003.html?__locale=en
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QspiNAND with ultra-fast write speed: A new option for over-the-air updating of automotive code
Technical Article
The growth in the number of processor-based Electronic Control Units (ECUs) in cars is a familiar trend. Of equal significance to automotive system architects is the concurrent growth in the code footprint of new and developing applications in the car, a result in part of the increasing implementati...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/qspinand-ultra-fast-write-speed-for-over-the-air-on-automotive.html?__locale=en
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Winbond wins 2020 ASPENCORE World Electronics Achievement Awards
News
TAICHUNG, Taiwan – November 9, 2020 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected by ASPENCORE analysts and their user community worldwide as one of the winners of 2020 ASPENCORE World...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-wins-2020-aspencore-world-electronics-achievement-awards.html?__locale=en
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Winbond introduces fully compatible drop-in replacement for SPI Flash memory offering comprehensive, end-to-end security for IoT devices
News
New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication (Taichung, TAIWAN – 25 February, 2020) -- Winbond Electronics ...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-introduces-fully-compatible-drop-in-replacement-for-spi-flash-in-iot.html?__locale=en
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Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards Winbond TrustME® W77Q wins 2021 China Elecfans IoT Technology Innovation Awards
News
TAICHUNG, Taiwan – 2021-12-13 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected as the winner of 2021 Elecfans IoT Technology Innovation Awards. Established by Elecfans, a well-known leadi...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_trustme_w77q_2021_china_elecfans_iot_awards.html?__locale=en
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Winbond and Karamba Security provide a comprehensive cybersecurity solution tailored for automotive and other IoT critical needs
News
Winbond’s New 128Mb TrustME® W77Q Secure Flash memory adds critical H/W protection to Karamba Security’s XGuard™ embedded security software, providing customers end to end runtime integrity protection for critical applications such as over-the-air updates TAICHUNG, Taiwan– 2021-12-08 – Winbond Elect...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_and_karamba_security_comprehensive_cybersecurity_solution_for_automotive_iot_needs.html?__locale=en
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Winbond and Karamba Security introduce an out-of-the-box solution for supply chain security
News
Based on Winbond TrustME® New W77Q Secure Flash memory and Karamba Security’s XGuard embedded security software, customers can use a drop-in replacement for existing Flash devices, supporting end-to-end runtime integrity check throughput the supply chain, including over-the-air updates for IoT contr...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-and-karamba-security-introduce-a-solution-for-supply-chain-security.html?__locale=en
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Winbond Unveils New 1.8V 512Mb SPI NOR Flash for 5G and Other High-End Server Applications
News
Industry pin-to-pin compatibility enables customers to grow their code storage Flash capacity from 16Mbits up to 2Gbits without having to change footprint across different hardware platforms Already proven and in small-batch production with leading global customers in different industries, the new s...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-1.8v-512mb-spi-nor-flash-for-5g-and-high-end-server-applications.html?__locale=en
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Winbond W77Q Secure Flash gains further endorsement with FIPS 140-3 Automated Cryptographic Validation Test System
News
W77Q offers greater security for 5G IoT applications with cryptographic components requiring cybersecurity. TAICHUNG, Taiwan—2021-11-03- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that their TrustME® W77Q Secure Flash has received FI...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_w77q_secure_flash_gains_fips_140_3_automated_crypyographic_validation_test_system.html?__locale=en
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How new secure flash devices promise security for IoT devices’ code and data
Technical Article
No embedded device manufacturers would claim that the exposure of connected devices to security threats is due to vulnerabilities in the security components available on the market today. This would be ridiculous: it is easy to find specialist components such as secure elements or high-end systems-o...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/how-to-promise-security-for-iot-devices-code-and-data.html?__locale=en
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New generation of wearable medical devices calls for secure, high-density non-volatile memory
Technical Article
As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly look...
http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/new-wearable-medical-devices-calls-for-secure-high-density-memory.html?__locale=en
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Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
News
Solution optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile and IoT SoCs Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoper...
http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-octalnand-flash-with-synopsys-designware-amba-ip-delivers-highdensity-nand-flash-memory-solution.html?__locale=en
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Keyword search results for “ Over-the-Air ”, 21 Matches