Search

Winbond TrustME® Secure Flash products strengthens the robustness by securing code and data storage for trusted boot and firmware updates using external secure flash. In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security...

http://20.24.31.78:8080/hq/hq/product/trustme/index.html?__locale=en

TAICHUNG, Taiwan – 2021-12-13 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected as the winner of 2021 Elecfans IoT Technology Innovation Awards. Established by Elecfans, a well-known leadi...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond_trustme_w77q_2021_china_elecfans_iot_awards.html?__locale=en

Winbond’s W77Q TrustME® Secure Flash memory provides a secure storage solution for systems with limited space, pins, and power, that meets Common Criteria EAL 2+ Security Certification requirements. W25Q NOR Flash Drop-in Replacement with Advanced Security The W77Q Secure Flash memory is a W25Q NOR ...

http://20.24.31.78:8080/hq/hq/product/trustme/w77q-trustme-secure-flash-memory/index.html?__locale=en

Winbond’s W77T TrustME® Secure Flash memory provides a secure storage solution for automotive application with ISO26262 ASIL-D compliance and high-performance storage needs, that meets ISO21434 Automotive CyberSecurity and Common Criteria EAL 2+ Security Certification requirements. Secure storage oc...

http://20.24.31.78:8080/hq/hq/product/trustme/w77t-secure-flash-memory/index.html?__locale=en

W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...

http://20.24.31.78:8080/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

Winbond Electronics Corporation today (Feb. 21st) announced that the company was awarded ISO 26262 certificate in accordance with highest safety standard in automotive vehicles. Winbond is also the first memory IC company who received the process certificate of ISO 26262, Road Vehicles – Functional ...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/news00485.html?__locale=en

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work and play. However, as our lives become more connected, the risk from hackers and other security breaches increases with every new IoT device. While most of us are pretty well versed in why we need to kee...

http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/the-hidden-security-risks-of-automotive-electronics-system.html?__locale=en

http://20.24.31.78:8080/hq/hq/support/faq/technical/.content/faq/faq00003.html?__locale=en

#Winbond #SmarterFuture #AllAboutMemory Winbond - Advanced Memory Solutions for a SMARTER FUTURE. Smarter Future is all about memory! In the next few years, the development of AI and 5G technologies will significantly push up IoT to the next level, while edge computing on each terminal devices will ...

http://20.24.31.78:8080/hq/hq/support/online-learning/video-item/video00015.html?__locale=en

Winbond Electronics Corporation publishes Sustainability Report every year to disclose our efforts, commitments and results on sustainability. As your organization is a key stakeholder to Winbond, we would like to ask you to complete this survey for us. In order to know what issues are most importan...

http://20.24.31.78:8080/hq/hq/about-winbond/csr-new/stakeholder-engagement/questionnaire/index.html?__locale=en

HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en

The world’s first x8 Octal interface for NAND flash memory, Winbond’s OctalNAND flash enables automotive and industrial manufacturers to provide code storage in high density without having to pay a premium for NOR flash, a fast memory technology which scales poorly at densities above 512Mbits. The f...

http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/octalnand-flash/index.html?__locale=en

[Taipei News] Winbond Electronics Corporation announced today a number of key organizational changes in its senior level management. The changes are designed to increase the Company's competitive position in the market by more closely aligning its core management expertise with current business cond...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/news00017.html?__locale=en

Tokyo, Japan and Taichung, Taiwan – 07 December 2018 -- Winbond Electronics Corporation (hereinafter: WB), a leading global supplier of semiconductor memory solutions in Taiwan, collaborates with Dai Nippon Printing Co., Ltd. (hereinafter: DNP) to increase the security level of IoT (Internet of Thin...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-collaborates-with-dnp-for-the-large-density-memory-esim-and-secure-element-development.html?__locale=en