Search

Winbond supplies the low-power, high-bandwidth 1Gb LPDDR3 DRAM die in the KL720 <span class="match">SoC</span> Kneron’s KL720 with Winbond DRAM inside sets new industry benchmark for power/performance ratio in edge AI applications TAICHUNG, Taiwan – September 22, 2020 – Winbond Electronics Corporation, a leading global suppli...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/high-bandwidth-1gb-lpddr3-helps-kneron-kl720-achieve-1.4-tops-throughput-in-edge-ai.html?__locale=en

Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 <span class="match">SoC</span> sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-1gb-lpddr3-in-tsing-micro-new-ai-image-processing-soc.html?__locale=en

With more complex application being put into modern electronic devices, higher throughput is expected within the IC. We could achieve this goal by speeding up the clock, or by adding more IOs. A higher clock will lead to Signal Integrity (SI) issue, like crosstalk, Electromagnetic Interference (EMI)...

http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/connection-between-soc-and-dram-with-ic-boundary-scan-technology.html?__locale=en

W75 and W77 series of Secure Flash devices protect data in connected and IoT devices from a wide range of hacking attacks and other security threats. W76 Secure Element provides certified solution for eUICC, mobile payments and other security-critical applications. Munich, Germany – 13 November, 201...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-secure-flash-at-electronica-provides-secure-external-storage-for-code-and-data-in-soc.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power <span class="match">SoC</span> is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

In response to demand from security-conscious OEMs, the manufacturers of modern microcontrollers and systems-on-chip (<span class="match">SoC</span>s) commonly equip their products with a broad range of security capabilities: standard, off-the-shelf 32-bit MCUs for mainstream, non-financial applications will today often featu...

http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/closing-the-security-gap-left-by-conventional-nor-flash.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en

Security weaknesses in companion Flash memory to an MCU or <span class="match">SoC</span> expose OEMs to the risk of product theft due to the cloning of reverse engineered PCB designs. Authentication flash memory provides a secure handshake between the controller and the memory to ensure enhanced security of the data transmit...

http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/authentication-flash/index.html?__locale=en

(HSINCHU, Taiwan –29TH April, 2020) -- With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular in coming years. To image that the affordable AIoT device can guide people how to...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-powering-aiot-and-8k-tv-with-1gb-lpddr3.html?__locale=en

Winbond 2006 eMEX Date: October18-21 Location: Suzhou International Expo Center, Expo Plaza, Suzhou Industrial Park Booth: 4H02 , Hall 4A Winbond is going to show our latest products and solutions at eMEX 2006. Winbond is the leading ICs manufacturer in Taiwan. We design and manufacture ICs products...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-displays-competitive-ic-products-at-emex-2006.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

To simplify the life of embedded designers looking to store code on NOR flash systems with densities beyond 512Mb, Winbond is offering QspiNAND products with the same SPI interface with a cost effective QspiNAND flash at 1Gb and 2Gb densities. While NOR flash is more cost effective at lower densitie...

http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/qspinand-flash/index.html?__locale=en

To simplify the life of embedded designers looking to store code on NOR flash systems with densities beyond 512Mb, Winbond is offering QspiNAND products with the same SPI interface with a cost effective QspiNAND flash at 1Gb and 2Gb densities. While NOR flash is more cost effective at lower densitie...

http://20.24.31.78:8080/hq/hq/product/code-storage-flash-memory/testseries1/index.html?__locale=en

TAICHUNG, Taiwan – November 9, 2020 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that TrustME® W77Q Secure Flash has been selected by ASPENCORE analysts and their user community worldwide as one of the winners of 2020 ASPENCORE World...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-wins-2020-aspencore-world-electronics-achievement-awards.html?__locale=en

SPI NOR Flash is the electronics design engineer’s favourite memory type for low-density, high-reliability storage of application code and data in embedded systems with a storage requirement of up to 512Mbits. To facilitate broad adoption across the industry, NOR Flash memory technology follows cert...

http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/safeguarding-boot-code-and-other-critical-data.html?__locale=en