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Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

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Winbond is offering a new way to extend the power savings available from Partial Array Self-Refresh (PASR), which was already specified in the JEDEC standard by implementing a new Deep Self-Refresh (DSR) mode. DSR operates in a similar way to PASR at <span class="match">low</span> data rates, allocating used data to one or mo...

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New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en

Winbond HyperRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-<span class="match">low</span> power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

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Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

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http://20.24.31.78:8080/hq/hq/about-winbond/company-profile/milestones/?__locale=en

Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, <span class="match">low</span>-power consumption and down-sizing. Fully understanding market...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-has-come-up-with-a-new-low-density-ddr3-sdram.html?__locale=en

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MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-<span class="match">low</span>-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-<span class="match">low</span> power and high performance of this product make it particularly suitable for...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

New W35N-JW NAND products featuring Winbond’s OctalNAND Flash offer robust and reliable code storage in automotive and industrial applications (Taichung, TAIWAN – 17 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the i...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-new-octalnand-provides-fast-low-cost-alternative-to-octal-nor-in-high-densities.html?__locale=en

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...

http://20.24.31.78:8080/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, <span class="match">low</span> power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

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Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

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Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

http://20.24.31.78:8080/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=en